November 22 2019
Global Flip Chip Technology Market research report: by wafer bumping process (CU pillar, lead-free), packaging technology (2D, 2.5D, 3D), packaging type (FC BGA, FC PGA, FC LGA), product, application (consumer electronics, automotive) – Forecast till 2023
Integrated circuit (IC) packaging has been revolutionized with advents made in flip chip technology. Introduced by IBM Corporation in 1960, this component has been transforming the face of consumer electronic devices ever since. The semiconductor device is designed to incorporate solder bumps over the connection pads of the IC or micro-electromechanical system (MEMS). Subsequently, it creates a reliable connection between the component and the board and this flip chip technology is finding its popularity amidst mainframe computers, personal computers, servers, notebooks, smartphones, tablets, and in other devices. Its features such as low power cost and high-density packaging are helping flip chip technology in gaining traction. The global Flip Chip Technology Market is expecting a substantial 8.29% CAGR to scale new heights during the forecast period (2017-2023). Market Research Future’s (MRFR) detailed study includes drivers that would impact crucially in the flip chip technology market growth and segments for a better understanding of the current market scenario.
However, its cost is still a challenge. The cost stems from wafer fabrication vendors, substrate vendors, and assembly/packaging subcontractors and it only increases with added assembling cost. But its pivotal role in consumer electronic devices can steer it out of future complication and ensure smooth market flow.
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Some of the major players in Flip Chip Technology market are Samsung Group (South Korea), Intel Corporation (U.S.), Global Foundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), Texas Instruments (U.S.) among others.
The global flip chip technology market can be segmented by wafer bumping process, packaging technology, packaging type, product, and application.
Based on the wafer bumping process, the flip chip technology market can be segmented into copper (CU) pillar, lead-free, Tin-lead eutectic solder and gold stud plated solder.
Based on the packaging technology, the flip chip technology market includes 2D, 2.5D, and 3D packaging technology.
Based on the packaging type, the flip chip technology market comprises FC BGA (Flip Chip Ball Grid Array), FC PGA (Flip Chip Pin Grid Array), FC LGA (Flip Chip Land Grid Array), FC QFN (Flip Chip Quad Flat No-Lead), FC SIP (Flip Chip System-In-Package), and FC CSP (Flip Chip-Chip-Scale Package).
Product-based segmentation of the flip chip technology market includes LED, CMOS image sensor, CPU, RF, Analog, Mixed Signal, and Power IC, SoC, and others. Regional Analysis:
The global flip chip technology market spans across regions such as North America, Europe, Asia Pacific (APAC), and the Rest-of-the-World (RoW).
The APAC region is leading the market with considerable margin, and its status will remain so during the forecast period. Countries such as China and India have emerged as exceptional manufacturing zones. These countries can further increase the flip chip technology market percolation opportunity. Big names such as Sony and Samsung are also from the region which is taking the market further ahead. North America is the second largest market, and it is due to the presence of a huge number of flip chip technology market behemoths. The region is also investing significantly in research and developments.
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TABLE OF CONTENTS
LIST OF FIGURES
FIGURE 1 Global Flip Chip Technology Market Segmentation
FIGURE 2 Forecast Methodology
FIGURE 3 Five Forces Analysis Of Global Flip Chip Technology Market
FIGURE 4 Value Chain Of Global Flip Chip Technology Market
FIGURE 5 Share Of Global Flip Chip Technology Market In 2017, By Country (In %)
FIGURE 6 Global Flip Chip Technology Market, 2017-2023,
FIGURE 7 Sub Segments Of Wafer Bumping Process
FIGURE 8 Global Flip Chip Technology Market Size By Wafer Bumping Process, 2017
FIGURE 9 Share Of Global Flip Chip Technology Market By Wafer Bumping Process, 2017 TO 2023
FIGURE 10 Global Flip Chip Technology Market Size By Packaging Technology, 2017 TO 2023
FIGURE 11 Share Of Global Flip Chip Technology Market By Packaging Technology, 2017 TO 2023
FIGURE 12 Global Flip Chip Technology Market Size By Application, 2017 TO 2023
Know More about this Report @ https://www.marketwatch.com/press-release/flip-chip-technology-market-2019---industry-size-trends-global-opportunities-sales-revenue-growth-factors-company-profile-competitive-landscape-and-regional-forecast-2023-2019-10-24
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