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Chip On Flex Market 2019 Global Overview, Sales Revenue, Size, Trends and Forecast 2021

Global Chip on Flex Market, By Type (Single Sided Chip On Flex, Others), By Application (Static, Dynamic), By Verticals (Military, Medical, Aerospace, Electronics) - Forecast 2021

Market Scenario: 

Chip on Flex is a very interesting and promising interconnection method that are used especially in portable electronic products such as mobile phones, portable terminals, and digital cameras and among others. In the process of Chip on Flex, integrated circuits (IC) are normally connected using anisotropically conductive adhesive.  Various technological advancement and development of cost effective flexible printed boards are major factors that affects the demand.

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Growing demand of Smartphone has made the significant growth in flexible printed circuit board industry. This is due to increasing global demand for mobile phones in recent years which led to substantial demand for flexible circuits. However, consumer electronics is expected to emerge as the fastest growing end-use market for flexible printed circuits worldwide. The physical characteristics of flexible printed circuit boards such as  lesser thickness, lesser weight, and the ability to take any forms, besides these reliability and functionality will contribute towards the growth of this market.

According to Market Research Future Analysis, Global chip on flex market has been valued at US $ ~1795 Million by the end of forecast period with CAGR of ~4.43% during forecast period 2016 to 2021.

Key Players

The prominent players in the market of Chip On Flex Market are – LGIT corporation (U.S.), Stemko group(Korea), Flexceed(Japan) , Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond technology co. ltd.(China), AKM industrial company ltd.(China), compass technology company limited(Hong Kong), Compunetics(U.S.), and Stars microelectronics public company ltd (Thailand) among others.

Segments:

The Global chip on flex Market has been segmented on the basis of types, applications and verticals. The types of chip on flex are one sided chip on flex and others. The applications comprises of static and dynamic flexing. The various verticals of chip on flex market are military, medical, aerospace, electronics and others.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

Intended Audience

  • COF manufactures
  • Industries such as aerospace, automotive, IT, industrial, and medical, among others
  • Government institutions
  • Research institutions
  • Adhesive manufacturers
  • Conductor and insulator manufacturers like silver, copper and others

Regional Analysis:

Market Research Future Analysis shows that Asia pacific is forecasted to dominate the market owing to presence of major COF manufactures in China. China is also the biggest consumption market of chip on flex.  The growth in Asia pacific region can also be attributed to stable growth of Taiwan economy owing to its economic structure and bureaucratic system.  North America will experience a growth in chip on flex market owing to huge number of automobile industries in the region. With the increasing demand of high quality automobiles in the North America region, the manufacturers have started focusing on the adaption of high quality manufacturing techniques and quality assurance procedures.  Europe will experience a consistent growth in the forecast period and will contribute approximately 25% in the global chip on flex revenue market.

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TABLE OF CONTENTS

1 Market Introduction

1.1 Introduction

1.2 Scope Of Study

1.2.1 Research Objective

1.2.2 Assumptions

1.2.3 Limitations

1.3 Market Structure

2 Research Methodology

2.1 Research Network Solution

2.2 Primary Research

2.3 Secondary Research

2.4 Forecast Model

2.4.1 Market Data Collection, Analysis & Forecast

2.4.2 Market Size Estimation

3 Market Dynamics

3.1 Introduction

3.2 Market Drivers

3.3 Market Challenges

3.4 Market Opportunities

3.5 Market Restraints

4 Executive Summary

5 Market Factor Analysis

5.1 Porter’s Five Forces Analysis

5.2 Supply Chain Analysis

Know More about this Report @ https://www.reuters.com/brandfeatures/venture-capital/article?id=87447

About Us:

At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.

Media Contact:

Market Research Future

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Magarpatta Road, Hadapsar,

Pune - 411028

Maharashtra, India

+1 646 845 9312

Email: sales@marketresearchfuture.com

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